-
1 wire-bonded chip
кристал з дротяним монтажемEnglish-Ukrainian dictionary of microelectronics > wire-bonded chip
-
2 chip
1) кристал (напр. ІС) 2) інтегральна схема, ІС; мікросхема (див. т-ж circuit, integration) 3) обколювати (напр. кристал) - array chip
- backbonded chip
- balls-down chip
- bare chip
- beam-leadedchip
- beam-leadchip
- bubble-domain chip
- bubble-memory chip
- bumped chip
- committed chip
- component chip
- contiguous-disk bubble chip
- contiguous-disk chip
- custom -built chip
- custom chip
- customizable chip
- dense chip
- discrete-device chip
- electronic chip
- face-down chip
- factory-programmable chip
- fast chip
- fault-free chip
- fault-tolerant chip
- flip chip
- full-wafer chip
- fuse-programmable chip
- gate-array chip
- glue chip
- heterogeneous chip
- highly-расked chip
- hybrid chip
- hyper chip
- IC chip
- individual circuit chip
- integrated-microcircuit chip
- mask-programmable chip
- master-slicechip
- masterchip
- master-slice logic chip
- memory chip
- micro chip
- microcircuit chip
- microprocessor chip
- monolithic chip
- multilead chip
- naked chip
- nongold backed chip
- opto chip
- packaged chip
- pedestal chip
- peripheral chip
- pipelined chip
- planar passivated chip
- Poly Use chip
- process-development chip
- process-validation chip
- resistor chip
- semiconductor chip
- SLS chip
- solder chip
- super chip
- support chip
- TAB chip
- test chip
- thick-film chip
- thin-film chip
- tolerant chip
- ultra chip
- uncommitted chip
- unpackaged chip
- wire-bonded chip
- XR chip
- X-ray made chip
- III-V chip -
3 device
1) прилад (напр. ІС, транзистор, діод); компонент; елемент 2) пристрій - active device
- add-on device
- analog device
- array device
- attached device
- backup device
- beam-leadeddevice
- beam-leaddevice
- bipolar device
- bipolar-MOS device
- blown-fuse device
- bubble-domain device
- bubble- device
- bucket-brigade device
- bulk асoustic-wave device
- bulk-channel carrier-transfer device
- bulk-effect device
- carrier-transfer device
- charge-coupled device
- charge-domain device
- charge-injection device
- charge-priming device
- charge-transfer device
- chip-and-wire device
- CMOS device
- CMOS/SOS device
- compound-semiconductor device
- contiguous-disk device
- controlled surface device
- custom-designed device
- custom device
- dense device
- depletion-modedevice
- depletiondevice
- dielectric isolation device
- diffused device
- discrete device
- double-diffused MOS device
- elastic-surface-wave device
- electrooptic device
- elementary device
- enchancement-mode device
- enchancement device
- end-use device
- epiplanar device
- epitaxial device
- FAMOS device
- field-effect device
- field-programmable device
- FIMOS device
- functional device
- graded-gap semiconductor device
- graded-gap device
- Gurm-effect device
- Gurm device
- Hall-effectdevice
- Halldevice
- hardeneddevice
- harddevice
- heteroepitaxial device
- heterojunction device
- high-gain device
- high-immunity noise device
- high-technology device
- high-threshold device
- homojunction device
- hybrid high-power device
- identification device
- I2L device
- image [imaging] device
- IMPATT device
- implanted device
- integrated-optic device
- integrated semiconductor device
- integration device
- interdigitated device
- interface device
- Josephson-junctiondevice
- Josephsondevice
- Josephson logic device
- junction-isolated device
- large-scale integrated device
- large-scale integration device
- latch-up free CMOS device
- leaded device
- leadless inverted device
- light-wave device
- locked-in device
- logic array device
- low-power Schottky device
- magnetostatic-wave device
- majority-carrier device
- mask-programmable device
- metal-masked device
- metal-semiconductor device
- microdiscrete device
- microelectronic device
- minority-carrier device
- MIS-type device
- MIS device
- mixed-process device
- mixed device
- molecular-beam epitaxy-based device
- monolithic device
- MOS device
- MTL device
- multilayered device
- multilevel device
- n-channel MOS device
- n-channel device
- negative-resistance device
- non-CPU device
- n–p–n device
- off-chip device
- on-chip device
- optocoupler semiconductor device
- optocoupling device
- passive device
- p-channel MOS device
- p-channel device
- peripheral device
- permalloy bubble device
- permalloy T-bar device
- photo-coupled semiconductor device
- photosensitive device
- piezoelectric device
- piggyback device
- planar device
- plotting device
- plug-in device
- p-n-p device
- positioning device
- printing device
- programmable logic-array device
- programmable device
- quantum device
- quantum-well device
- redundancy device
- resin-molded device
- SAW device
- SAW delay device
- scaled-downdevice
- scaleddevice
- Schottky-barrier device
- Schottky device
- second-source device
- self-aligned semiconductor device
- semiconductor-on-sapphire
- silicon-on-dielectric device
- silicon-on-insulator device
- silicon-on-sapphire device
- single device
- single-crystal device
- slow device
- SLS device
- small-geometry device
- solder-evacuator device
- SOS/MOS device
- stacked semiconductor device
- static-sensitive device
- stripeline device
- submicron-scale MOS device
- superconducting Josephson-junction device
- superconducting quantum interference device
- superconductive quantum interferometric device
- super-lattice functional device
- superstructure device
- surface-acoustic-wave device
- surface charge-transfer device
- surface-mounted device
- switching device
- TAB device
- thermocompression bonded device
- thick-film device
- thin-film device
- transcalent device
- transferred-electron device
- transil-time-negative-resistance device
- trench isolated device
- tunnel -еffect device
- tunnel device
- two-level polysilicon MOS device
- ULA device
- ultrafine-scale device
- ultra-large-scale integrated device
- ultra-submicron device
- uncased device
- vertical-junction device
- very large-scale integrated-circuit device
- very large-scale integration device
- V-groove MOS device
- V-groove device
- wafer-printing device -
4 hybrid
1) гібридна ІС, ГІС 2) гібридний - bare hybrid
- chip-and-wire hybrid
- custom hybrid
- customized hybrid
- digital hybrid
- encapsulated hybrid
- filter hybrid
- gate array hybrid
- large-scale integration hybrid
- large-scale hybrid
- linear hybrid
- multichip hybrid
- multilayer hybrid
- parylene-coated hybrid
- pin-FET hybrid
- plastic-coated hybrid
- plastic-encapsulated hybrid
- tape bonded hybrid
- thick-film solder-reflow hybrid
- thin-film hybrid
См. также в других словарях:
wire-bonded chip — lustas su vieliniais išvadais statusas T sritis radioelektronika atitikmenys: angl. wire bonded chip vok. drahtgebondetes Chip, n rus. кристалл ИС с проволочными выводами, m pranc. puce avec sorties en fil, f … Radioelektronikos terminų žodynas
drahtgebondetes Chip — lustas su vieliniais išvadais statusas T sritis radioelektronika atitikmenys: angl. wire bonded chip vok. drahtgebondetes Chip, n rus. кристалл ИС с проволочными выводами, m pranc. puce avec sorties en fil, f … Radioelektronikos terminų žodynas
lustas su vieliniais išvadais — statusas T sritis radioelektronika atitikmenys: angl. wire bonded chip vok. drahtgebondetes Chip, n rus. кристалл ИС с проволочными выводами, m pranc. puce avec sorties en fil, f … Radioelektronikos terminų žodynas
puce avec sorties en fil — lustas su vieliniais išvadais statusas T sritis radioelektronika atitikmenys: angl. wire bonded chip vok. drahtgebondetes Chip, n rus. кристалл ИС с проволочными выводами, m pranc. puce avec sorties en fil, f … Radioelektronikos terminų žodynas
кристалл ИС с проволочными выводами — lustas su vieliniais išvadais statusas T sritis radioelektronika atitikmenys: angl. wire bonded chip vok. drahtgebondetes Chip, n rus. кристалл ИС с проволочными выводами, m pranc. puce avec sorties en fil, f … Radioelektronikos terminų žodynas
Surface-mount technology — (SMT) is a method for constructing electronic circuits in which the components (SMC, or Surface Mounted Components) are mounted directly onto the surface of printed circuit boards (PCBs). Electronic devices so made are called surface mount… … Wikipedia
Charge-coupled device — A specially developed CCD used for ultraviolet imaging in a wire bonded package. A charge coupled device (CCD) is a device for the movement of electrical charge, usually from within the device to an area where the charge can be manipulated, for… … Wikipedia
Ball grid array — For other uses, see BGA (disambiguation). Intel Embedded Pentium MMX (bottom view) A ball grid array (BGA) is a type of surface mount packaging used for integrated circuits. Contents … Wikipedia
Xeon — New Intel Xeon Logo used in 2011 Produced From 1998 to present Common manufacturer(s) … Wikipedia
Bluetooth — This article is about the electronic protocol. For the medieval King of Denmark, see Harald I of Denmark. Bluetooth logo Bluetooth is a proprietary open wireless technology standard for exchanging data over short distances (using short wavelength … Wikipedia
Three-dimensional integrated circuit — In electronics, a three dimensional integrated circuit (3D IC, 3D IC, or 3 D IC) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor… … Wikipedia
